NOVA-DC S2

A dual-socket server mainboard, taken apart one layer at a time. Scroll to open it up.

440 × 300 mm board, 16 layers, 34 modeled parts.

Thirty-four parts, one stack

Backplates sit under the board. Sockets, memory slots and connectors rise first, then CPUs, load plates, thermal paste, heatsinks and screws.

Two processors

Each LGA4677 socket takes a 56-core CPU under a nickel heat spreader. A load plate and two levers clamp it onto 4,677 contacts.

Heat leaves through the fins

A copper plate meets the CPU through a thin layer of paste. Four heat pipes carry the heat into 33 aluminium fins, and chassis fans push air straight through.

Twelve DIMMs, parallel to airflow

Six registered DDR5 modules flank each CPU. Running along the airflow lets cool air pass over every module.

Power stays close to the CPU

Seven power stages and fourteen chokes per socket, backed by polymer capacitors and two 8-pin 12 V inputs at the rear.

Connectivity and management

An OCP NIC 3.0 card adds dual 25 GbE. Riser slots, MCIO ports and a BMC with its own flash round out the I/O.

Two boards, one build method

The same modeling approach covers a 2U server board and a compact desktop board. Each one opens in its own full 3D viewer.

NOVA-DC S2 assembled NOVA-DC S2 exploded into layers

NOVA-DC S2

Dual-socket server mainboard for a 2U chassis, with two 56-core CPUs, twelve DDR5 slots and an OCP network card.

Board
440 × 300 mm, 16 layers
Compute
2 × LGA4677
Memory
12 × DDR5 RDIMM
Modeled parts
34
Mini-ITX board assembled Mini-ITX board exploded into layers

NOVA-ITX Z9

Compact desktop board with a socketed CPU, a spring-loaded cooler with a spinning fan, two DIMM slots and an M.2 drive.

Board
170 × 170 mm
Compute
1 × LGA1700
Cooling
60 mm fan, fin stack
Modeled parts
29

Anatomy of the server board

Six assemblies, each isolated from the rest of the stack. Select one to open the viewer focused on that part.

NOVA-DC S2 at a glance

Concept hardware. Figures describe the 3D model and are illustrative, not a shipping product.

Board

440 × 300 mm, 16 layers, 2.4 mm thick

Compute

Two LGA4677 sockets, 56 cores and 112 threads per CPU, 350 W each

Memory

Twelve DDR5 RDIMM slots, six per CPU, parallel to airflow

Expansion

Two PCIe 5.0 x16 riser slots, OCP NIC 3.0, four MCIO x8 connectors, M.2 2280 boot slot

Management

BMC with SPI flash and DRAM, dedicated management Ethernet, VGA, two USB 3.0

Power

Two 8-pin 12 V inputs, seven power stages and fourteen chokes per socket

Cooling

Passive 2U heatsinks with four heat pipes each, six 6-pin fan headers

Model

34 separately selectable parts, rendered live with Three.js

Top view of the NOVA-DC S2 board

Design notes

Three decisions shaped the layout.

Airflow sets the layout

DIMM slots and heatsink fins run front to back. The power stages sit downstream of the CPUs, and the fan headers line the front edge.

Two sockets, mirrored

Each CPU has its own memory, power stages and PCIe lanes, so the board reads as two identical halves with shared I/O.

Parts you can pull apart

Every layer is separately selectable in the model, so the explode order doubles as an assembly and service sequence.